Slicing & Masking Specialty Non-UL

FM-28

FM28 is a pressure sensitive masking tape designed for use in extreme high temperature conditions. The polyimide backing, combined with thermosetting silicone adhesive, provides superior flame and chemical resistance. It can withstand exposure temperatures up to and in excess of 400°F, making it ideal for masking gold fingers during wave solder operation and 'powder coat' masking.

Tensile (lbs/in)	Adhesion (oz/in)	Thickness (mils)	Elongation (%)
30	25	2.5	80.0

FM-29

http://www.intertapepolymer.com/PublishingImages/industrialnewcore/IND_SPC_FM28_IMG.jpg

A pressure sensitive masking tape designed for use in extreme high temperature (400°F) conditions. The polyimide backing combined with thermosetting silicone adhesive, provides superior flame and chemical resistance. FM29 can be used for 'powder coat' masking as well as masking gold fingers during wave solder operation.

Tensile (lbs/in)	Adhesion (oz/in)	Thickness (mils)	Elongation (%)
65	25	3.5	80.0

LA-26

Combining the moisture, chemical, abrasion and puncture resistance of polyester film with the machine direction strength and dimensional stability of rope-fiber paper backing, this pressure sensitive adhesive is designed for use in high temperature conditions. It is ideal for tabbing, holding and wrapping, masking PCB gold fingers during wave solder and HAL operations. It can also be used for 'powder coat' masking.

Tensile (lbs/in)	Adhesion (oz/in)	Thickness (mils)	Elongation (%)
45	60	6.0	2.0